China Electronics Technology Fenghua Company Participated in the CSIF2023 Third Generation Semicondu
2023-08-25
On August 24-25, 2023, the CSIF 2023 Third Generation Semiconductor Material Manufacturing and Equipment Technology Summit Forum was held in Wuxi. The exhibition features the theme of "domestic substitution, cost reduction and efficiency improvement", bringing together nearly 400 SiC industry enterprises to participate. China Electronics Technology Fenghua Co., Ltd. debuted at the forum with Mars 4410 SiC wafer defect detection process equipment solution.
Once the device was unveiled, it attracted the attention and communication of many professionals, demonstrating the urgent demand for defect detection equipment in the industry. General Manager Wu Hongkun was invited to attend the high-level closed door meeting of this forum to discuss the prospects and development direction of the SiC industry with many well-known entrepreneurs in the industry.
In recent years, Fenghua Company has continuously conquered the key core technology of SiC wafer testing equipment, and has achieved mass production capacity and engineering application level. The company has reached cooperation with multiple well-known domestic substrate and epitaxial manufacturers. This device has performance advantages such as multi scenario universality, defect correlation with device yield, fully independent intellectual property rights, and localization of core components. Key technologies have been repeatedly studied and demonstrated.