Online small and medium size automatic bonding production line
Product description:
This production line is mainly used for the cleaning + bonding process in the display manufacturing process of OLED smart wearable display/electronic paper/mobile phone screen/laptop/PAD/vehicle.
The production line is composed of plasma cleaning machine + automatic COG (compatible with COF) bonding machine + automatic FOG (compatible with FOF) bonding machine + automatic FOB bonding machine, which can complete terminal cleaning, IC bonding and FPC bonding in the module process. Fixed, PCB bonding process. It has the characteristics of high temperature and pressure control accuracy, high stability of bonding accuracy, automatic loading and unloading, visual positioning/alignment/detection, code scanning, and CIM functions.
