SDI/PDI series wafer macro/micro defect inspection equipment
Product description:
The SDI/PDI series of instruments are designed for automated surface macro-defect inspection of wafers or glass materials with a certain degree of light transmittance, such as cut wafers, grinding wafers, polishing wafers, substrate wafers, and epitaxial wafers, during the wafer growth process. They can be used to inspect semiconductor and optoelectronic materials, including silicon carbide, silicon wafers, and infrared materials. Optional expansion modules can be added to enable capabilities such as sample flipping, multi-point wafer thickness measurement, chamfer surface dimension measurement, 3D/2D profile measurement, and defect depth measurement. These instruments meet the needs of macro-defect inspection and device yield improvement during production for 4-, 6-, and 8-inch wafers, as well as non-standard custom sizes.
