Venus series patterned wafer defect inspection and advanced packaging inspection/measurement equipme
Product description:
The Venus series is designed for particle and defect inspection on patterned wafers or devices made of silicon, silicon carbide, and other compound semiconductors. It also inspects blue-film cut and expanded wafers for defects, and performs TGV and RDL inspection and measurement for advanced packaging. The equipment utilizes multi-channel, bright-field and dark-field simultaneous inspection, combining multi-wavelength (W/R/G/B) inspection with variable magnification imaging for full-wafer scanning and high-magnification defect review. It automatically detects various defects on patterned chips and generates defect coordinate maps. It offers advantages such as multi-channel simultaneous single-shot inspection, high throughput, and high compatibility.
